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Home>Scientific Instruments>Osmium Plasma Coater>Technical data>Coss sectional TEM image alternately laminated film
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Scientific Instruments

UV Ozone Cleaner
Osmium Plasma Coater
+ Product details
+ Lineup
+ Accessories
+ Technical data
・ MgO crystals
・ Human Lymphocyte
・ Barium Titanate
・ Ant
・ Rat Liver
・ Chicken Leg Tendon
・ Resist Hole
・ Silicon Wafer
・ Protective film for FIB
・ Silicon under FIB
・ Cross sectional TEM image alternately laminated film
・ Trench observation of silicon wafer
・ Conductive ultra-thin film coating mechanism Hydrophilization treatment
・ Naphthalene - Osmium Hybrid coating
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Vacuum Electron Staining Apparatus


Conductive thin film production device for electron microscope sample preparation
Osmium Plasma Coater
Product details/Lineup/Accessories/Technical data/Contract service/Maintenance

Osmium Plasma Coater(OPC) is the plasma coating device that uses the DC glow discharge method to coat conductive thin film mainly for SEM samples.
オスミウム・プラズマコーター オスミウムコーター


Technical data

SEM images
MgO crystals/Human Lymphocyte/Barium Titanate/Ant/Rat Liver/Chicken Leg Tendon/Resist Hole/Silicon Wafer
Others
Protective film for FIB/Silicon under FIB/Cross sectional TEM image alternately laminated film/Trench observation of silicon wafer/Conductive ultra-thin film coating mechanism Hydrophilization treatment/Naphthalene - Osmium Hybrid coating


Cross sectional TEM image alternately laminated film

The repeatability of the film thickness was confirmed by alternately laminating the osmium ultra-thin film and the plasma-polymerized film.

■Sample:Epoxy block Size:10mmφ×3mmt

Condition1
① Plasma-polymerized film and osmium film are alternately coated on epoxy block with low current method.
Each setting film thickness is as follows.
  Naphthalene  10nm  6 layers
  Osmium      1nm  5 layers
② Re-embedded epoxy block with epoxy resin
③ After cross-sectioning with an ultramicrotome, perform TEM observation.
⇒
Condition2
① Plasma-polymerized film and osmium film are alternately coated on epoxy block by mixed gas method.
Each setting film thickness is as follows.
  Naphthalene  10nm  7 layers
  Osmium      1nm  6 layers(*)
(*However, only the 4th layers was discharged for 4 seconds without mixed gas.)
② Re-embedded epoxy block with epoxy resin
③ After cross-sectioning with an ultramicrotome, perform TEM observation
⇒


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